Can only say that the factors affecting the speed of the SMT mounter are many. For example: we choose the mounter, the equipment selected good, stable machine operation, accurate mounter, naturally also improve the production efficiency. Operator professional skills and maintenance, a move will also have an impact. Therefore, to improve the speed of SMT placement processing, you can start from all aspects.

As a matter of fact, the placement machine should not only pay attention to the speed of placement, but also pay attention to the quality and accuracy. In practice, each bonder has different standards and efficiency.

The number of each part on the PCB and the placement direction on the feed table are two factors that influence each other. For those parts that are more in number, they should be placed together to minimize the work on the feed table.

The speed of the rotating tower is set and determines the speed at which the rotating tower runs after picking up the components. The speed of the rotating tower depends on the size of the component. The larger the component, the lower the speed. Therefore, there is a limit to how far the rotating tower can be set. For the installation program, do not put components with different rotating tower speeds together. On the one hand, it prevents the different speeds of the components' rotating towers from affecting their full utilization.

The feeding work of the bonder. This is because when the feeder is switched from one direction to the other, the machine still moves at a higher speed, but when the direction of the feeder is switched to more than one direction, the speed of the feeder will be reduced by one-third to one-half.

The speed interval of the X-Y working platform is an important factor affecting the operation of the machine and is the focus of many optimization software concerns.

All of the above mentioned issues are some of the key aspects that affect the speed of an image bonder. In the actual production process, there will be a variety of other issues that will cause the speed of the SMT placement equipment to drop, and that will need to be dealt with on a case-by-case basis.