In the SMT chip processing (surface mount technology) process, there are a variety of components, one of the more special called "crystal". The next step is to introduce this component and explain the reasons for the failure of this product in the SMT mounting process:

The crystal oscillator (crystal oscillator) is particularly sensitive to vibration and stress due to its unique physical properties. This sensitivity requires us to be particularly stringent in the process control of the crystal oscillator during the entire SMD processing.

The sensitivity of crystal oscillators stems from the fineness of their internal structure. Vibration and stress may lead to small changes in its internal structure, which in turn triggers instability in frequency deviation and output voltage. Therefore, special attention needs to be paid to avoid any possible stresses in the SMT process, both in the lead molding stage and in the SMT mounting and soldering processes.

First of all, in the lead molding stage of the crystal oscillator, it is necessary to avoid the impact of excessive stress on the leads. Especially for high-precision crystal oscillators, fine control of the stress in the molding process is required.

Secondly, during PCB design, the placement of the crystal at the edge position of the collocation board should be avoided to reduce the stress that may be generated during the depaneling process. In addition, manual depaneling is not recommended for PCBAs (Printed Circuit Board Assemblies) with crystals to ensure the safety of the crystals.

In practice, there have been cases where improper handling has affected the crystal oscillator. For example, the use of a template to hold the shear during lead molding may result in frequency deviation due to the stress generated by the cut foot and transmitted to the inside of the crystal. In addition, improper depaneling may also lead to crystal failure, which is manifested as abnormal output voltage.

Therefore, xvias Technology would like to say that it is necessary to strengthen the process control of crystal oscillator in the SMT SMD process. By finely controlling each process and avoiding stress generation, we can ensure the stability and reliability of the crystal oscillator, thus improving the performance of the whole product.