BGA chip disassembly is a delicate task in the circuit board mounter process. Because the BGA chip pin connection is different from the traditional chip, so you need to use a specific method and professional disassembly operator for disassembly.
First, the disassembly process of common problems:
1. The solder joints are not cleaned up, resulting in BGA chips are not completely separated.
2. The temperature is too high, resulting in a short circuit or damage to the circuit board.
3. The connection between the chip and the circuit board is not strong enough or improper operation caused by the BGA chip off.
4.BGA is sensitive to static electricity, the operation process generates static electricity will damage the chip.
5. Improper use of tools leads to damage.
Second, disassembly steps:
1. Preparation stage
Ensure that the work area is clean and tidy, free of dust and pollutants.
Use anti-static equipment, such as anti-static gloves, anti-static mats, etc., in order to avoid static electricity on the chip and circuit board damage.
Prepare necessary tools, including hot air gun, flux, solder sucker, solder wire, BGA chip extractor, etc.
2. Observe the BGA chip
Check whether the pins of the BGA chip are intact, damaged or broken.
Observe the connection between the BGA chip and the circuit board to understand the distribution of solder joints and connection methods.
3. Apply flux
Apply an appropriate amount of flux around the BGA chip to ensure that the flux covers all the solder joints.
The purpose of the flux is to reduce the surface tension of the solder joints so that the solder can flow more easily.
4. Heat with a hot air gun
Aim the hot air gun at the BGA chip area and gradually raise the temperature to heat.
Be careful to heat the entire BGA chip area evenly to avoid localized overheating leading to chip or circuit board damage.
5. Observe the state of the solder
Observe the state of the solder at any time, when the solder begins to melt and become liquid, stop heating.
If you find that the solder is not completely melted, you can heat it again, but avoid overheating.
6. Use a solder sucker to suck up the solder.
Aim the pipette at the soldering point of the BGA chip and gently suck up the melted solder.
Pay attention to the nozzle of the solder sucker to closely fit the solder joints to avoid damage to the circuit board.
7. Check and clean up the residue
After sucking up the solder, check whether there is any residual solder or impurities on the circuit board. If there is any residue, use a soldering iron or cleaning agent to clean up
8. Extract BGA chips
Use the BGA chip extractor or solder sucker to gently lift the BGA chip.
Be careful not to use too much force, so as not to damage the solder joints and circuit boards.
9.Clean up the working area
After completing the BGA chip removal, clean up the work area to ensure neat and orderly.
Return the tool to its place for next use.
III. Tips and Suggestions:
1. In the heating process, you can move the position of the hot air gun at the right time to ensure uniform heating of the entire BGA chip area.
2. When using a solder absorber, you can gently move the absorber from side to side to better absorb the melted solder.
3. If you encounter solder joints that are difficult to clean, you can use a soldering iron or cleaning agent to assist in cleaning.
4. When extracting BGA chips, you can use the leverage of the BGA chip extractor to gently lift the chips.
5. For novice operators, it is recommended to have some practice first to familiarize with the tools and operation process before actual operation.
6. For those unfamiliar with BGA chip removal operations, it is recommended to seek assistance from experienced technicians and strictly follow the recommendations and specifications provided by the manufacturer. If you have any different suggestions, please feel free to contact us to discuss!
Shenzhen Xinfeijia Technology Co., Ltd, stationed in the electronics manufacturing industry for many years, is committed to providing PCBA production services. We specialize in SMT chip processing, DIP plug-in processing and assembly of finished electronic products, from PCB design, circuit board manufacturing to component sourcing, assembly, soldering, testing, we can provide you with one-stop OEM and ODM services. Our goal is to help the electronics industry to simplify the production process, improve efficiency and ensure the smooth delivery of electronic products.
