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Analysis and countermeasures for the detachment phenomenon of double-sided board components in SMT processing

2024-03-15 Admin 1023

One of the problems that may occur when SMD processing double-sided panels is the detachment of components. This problem not only affects the performance of the product, but also may cause safety problems. In this article, we will deeply analyze the reasons for the phenomenon of PCBA processing double-sided board components falling off, and put forward corresponding countermeasures.


Component shedding is a complex problem, involving many factors.


1. The influence of the welding process


The choice of welding temperature, time and welding material is critical. Inappropriate soldering process may lead to unstable quality of solder joints, so that components can not be firmly attached to the PCB. In addition, too high a soldering temperature may lead to excessive melting of the solder joints, reducing their mechanical strength and making the components easy to fall off during subsequent handling or transportation.


Countermeasure: With proper component layout, you can ensure their stability during assembly, thereby reducing the risk of detachment due to vibration and shock. In addition, the use of high-quality components and soldering materials can further enhance the firmness of the solder joints.


2.PCB surface cleanliness


If there is dirt, grease or other contaminants on the surface of the PCB, the adhesion of the solder joints will be seriously affected, which will lead to component detachment.


Countermeasure: Keeping the PCB surface clean is one of the most important measures to prevent components from falling off.


3. Vibration or shock


After the installation of components is completed, if the double-sided board is subjected to excessive vibration or shock during transportation or use, the components may fall off due to mechanical stress.


Countermeasures: Realized by adding buffer materials on PCBA, improving packaging methods, etc. to reduce the impact of vibration and shock on components.


4. Quality of components and solder materials


Low-quality components and soldering materials may not have sufficient adhesion, which can easily lead to fall off.


Countermeasures: Choose high quality components and soldering materials, and through regular quality control and inspection, potential problems can be detected and solved in time to ensure the quality and stability of PCBA.


There are some other reasons, but no matter what problems occur, we have to find the problem in time and solve the problem quickly.



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